• Thermal conductivity: 1.4 W/(m·K).
• Easy 1:1 mix ratio with 45 min working time.
• Cure time: 24 hours at room temperature or 1 hour at 65°C (149°F).
• Provides strong electrical insulation.
• Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons.

This heatsink adhesive paste is a 2-part, 1-1 epoxy system. It is a smooth, dark grey paste that cures to form a hard, durable, thermally conductive polymer. It provides strong electrical insulation and excellent protection from humidity, salt water, mild bases, and aliphatic hydrocarbons. It bonds well to metals, ceramics, glass, and most plastics used in electronic assemblies. This thermal adhesive paste is most often used to attach heatsinks to CPUs, LEDs, or other heat generating electronic components. It is also suitable in many other applications that require a thermally conductive electrically insulating bond. This compound has been formulated for high thermal conductivity. It is highly viscous and must be mixed by hand prior to application. We also offer a lower viscosity alternative (8349TFM) that is suitable for use with mixing tips. This adhesive paste has a 45-minute working time. We also offer a faster setting alternative with a working time of only 5 minutes (8329TFM) and 20 minutes (8349TFM), a heat cure 2-part system with a 4-hour working time (8329TCS), and a heat-cure 1-part alternative with an unlimited working time (9460TC). Electrically conductive alternatives and thermal pastes are also available. Application Instructions: Read the product SDS and Application Guide, for more detailed instructions before using this product provided in Product guides and documents section below. Recommended Preparation: Clean the substrate with Isopropyl Alcohol, MG #824 so the surface is free of oils, dust, and other residues. 1. Stir each part individually to re-incorporate material that may have separated during storage. 2. Measure 0.93 part by weight of A. 3. Measure 1 part by weight of B. 4. Thoroughly mix parts A and B together. 5. Apply adhesive to the application area. Cure Instructions: Allow to cure at room temperature for 24 hours, or cure the adhesive in an oven at one of these time/temperature options: 1 hour @ 65 °C, 45 minutes @ 80 °C, 20 minutes @ 100 °C Storage and Handling: Store between 16 and 27 ˚C in a dry area, away from sunlight (see SDS). To maximize shelf life, recap product firmly when not in use.