Application:NC-559-ASM-UV is formulated for syringe, stencil printing, and rework applications on all PCB surface finishes. It may be used for BGA sphere attachment and reballing. It is also designed to work on all flip chip bumping and chip scale packaging sites. Cleaning:NC-559-ASM is a no-clean tacky flux that can be left on the board for many SMT assemblies.
Trustpilot
4 days ago
3 weeks ago