

💡 Stay Cool, Stay Ahead!
The Gelid Solutions HeatPhase Ultra Thermal Pad is a high-performance thermal interface designed for Intel CPUs. Measuring 40x30x0.2mm, it boasts an impressive thermal conductivity of 8.5W/mk, ensuring efficient heat dissipation. Its user-friendly design allows for easy application and removal, making it ideal for both novices and experts. The pad is ultra-durable, non-curing, and non-electrically conductive, providing reliable performance without the risk of electrical damage.






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