http://conductivex.com/Silver-Mixed-Epoxy-Electrically-Conductive-Adhesive-EMI-RFI-Sheilding-System-1-Part-Heat-CureElectro-Bond G2 represents the newest technology since the introduction of electrically conductive silver compounds. This unique formulation is based on a silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulation. This concept opens the door to a wide range of applications previously prohibited by the much higher cost of conventional silver conductive. Electro-Bond G2 cures at room temperature or can be accelerated with mild heat to form a tenacious bond between similar and dissimilar substrates such as aluminum, copper, magnesium, steel, bronze nickel, ceramic, glass, phenolic, and G-10 epoxy glass boards. because of its excellent continuity, has been used extensively in such diversified applications as, microwave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave-guides, electronic modules, flat cable, high frequency shields, connections, and circuitry and as a cold solder. This unique formulation offers ease in handling due to its creamy consistency and versatile application by hand, automatic dispenser, silk-screening, transfer or stamping techniques. "Appearance - SilverBenefits - Designed for high strength application, electrical properties with perfect bonding.Components - 1Compressive - 12000Cure Schedule - 2 hours @ 120 C1 hour @ 150 C1/2 hour @ 175 CCure Type - Heat CureFiller - Silver Hardness - 83Heat - 175Lap - 8700Operating - from 50 to +204CParticle Size - 40Reactive - 2.59Shelf - 6 monthsSpecific - 2.59Substrates - aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit boardTensile - 8700Thermal - 2.65Thermal - 18.37Thermal - 0.49Typical - EMI & RFI shielding, in the assembly or repair of printed circuit boards
Trustpilot
2 days ago
4 days ago
